DB34/T 3365-2019 Active Anhui ProvinceLocal standards

DB34/T 3365-2019 Printed circuit board solderability test (dip-side method)

DB34/T 3365-2019 Printed circuit board solderability test (dip-side method)

Publish Date: 2019-07-01 Implement Date: 2019-09-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: DB34/T 3365-2019
Standard Type: Local standards
Standard Status: Active
is_force_gb: no
CCS Name: Printed circuit board
ICS Name: Printed circuits and printed circuit boards
Publish Date: 2019-07-01
Implement Date: 2019-09-01
Pages: 7 pages

Scope

This standard specifies the terms and definitions, equipment and reagents, samples, test steps, judgment, and reporting for the edge-dip method of determining the solderability of printed circuit boards. This standard applies to the determination of the solderability of the surface metal conductors of printed circuit boards by the edge-dip method, and is not applicable to the determination of the solderability of the plated holes of printed circuit boards.

Development Information

Pages: 7 pages

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