T/SOECC 005-4-2022 Enamel-insulated copper-clad aluminum round wire - Part 4: 180-grade polyester-imide-insulated copper-clad aluminum round wire

Scope

Main Technical Content: Copper-Clad Aluminum Round Wire for Winding, Part 4: 180-Grade Polyester Imide Enamel Copper-Clad Aluminum Round Wire 1 Scope This part specifies the requirements for single-layer enamel copper-clad aluminum round wire based on polyester imide resin. If the chemical properties of the original resin can be preserved and all the requirements of this enamel wire are met, the resin can be modified. Note: A modified resin is one that has undergone chemical changes or contains one or more additives to improve its performance or usage characteristics. The "180-Grade" indicates the thermal rating, which requires a minimum temperature index of 180 and a thermal shock temperature of at least 200°C. The Celsius temperature corresponding to the temperature index is not the recommended operating temperature for the enamel wire, as this depends on many factors, including the type of equipment used. The nominal diameter range of the conductor specified in this part is: — Level 1: 0.071 mm and above, 3.150 mm and below; — Level 2: 0.071 mm and above, 5.000 mm and below; — Level 3: 0.250 mm and above, 1.600 mm and below. The nominal diameter of the conductor shall comply with the provisions of Section 4.2 of Part 1. 2 Normative Reference Documents The provisions of the following documents are incorporated into this part by reference from T/SOECC. For dated reference documents, all subsequent amendment bulletins (excluding errata) or revised editions shall not apply to this part. However, parties reaching agreements based on this part are encouraged to consider whether the latest versions of these documents can be used. For undated reference documents, the latest versions shall apply to this part. T/SOECC 005.1-2022 Copper-Clad Aluminum Round Wire for Winding, Part 1: General Provisions 3 Definitions, Test Methods and General Requirements 3.1 Definitions, Test Methods and General Requirements See Section 5 of Part 1 for defini

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