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GB/T 8750-2007
GB/T 8750-2007 Gold bonding wire for semiconductor devices
Abstract
This standard specifies the requirements, test methods, inspection rules, and marking, packaging, transportation, and storage for bonding wires used in semiconductor devices. This standard applies to drawn or extruded gold wires used for internal leads in semiconductor devices.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Replaced |
| Standard Code | GB/T 8750-2007 |
| CCS | Precious metals and their alloys |
| ICS | Other non-ferrous metal products |
| Implement Date | 2008-06-01 |
Price
$ 57
Subtotal
$ 57
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$ 0.00
Order Total (incl. tax)
$ 57