GB/T 8750-2007 Replaced National standards

GB/T 8750-2007 Gold bonding wire for semiconductor devices

GB/T 8750-2007 Gold bonding wire for semiconductor devices

Publish Date: 2007-11-23 Implement Date: 2008-06-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 8750-2007

Standard Type: National standards

Standard Status: Replaced

is_force_gb: no

CCS Name: Precious metals and their alloys

ICS Name: Other non-ferrous metal products

Publish Date: 2007-11-23

Implement Date: 2008-06-01

Pages: 15 pages

Scope

This standard specifies the requirements, test methods, inspection rules, and marking, packaging, transportation, and storage for bonding wires used in semiconductor devices. This standard applies to drawn or extruded gold wires used for internal leads in semiconductor devices.

Development Information

Word Count: 27 Thousand words Pages: 15 pages

Replace the following standards

GB/T 8750-1997 Gold wire for semiconductor devices lead bonding

Superseded by the following standards

GB/T 8750-2014 Gold bonding wire for semiconductor package

Referenced Standards

GB/T 10573-1989 Tensile testing method for fine wire of non-ferrous metals GB/T 10573-2020 Tensile testing method for fine wire of nonferrous metals GB/T 11066.5-1989 Gold—Determination of silver, copper, iron, lead, antimony and bismuth contents—Emission spectrometric method GB/T 11066.5-2008 Methods for chemical analysis of gold—Determination of silver,copper,iron,lead,antimony and bismuth contents—Atomic emission spectrometry GB/T 15077-1994 Geometric size measuring methods of precious metals and their alloy materials GB/T 15077-2008 Geometric size measuring methods of precious metals and their alloy materials

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