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GB/T 4937.16-2025 Active
GB/T 4937.16-2025 Semiconductor devices—Mechanical and climatic test methods—Part 16:Particle impact noise detection(PIND)
Abstract
This document describes the method of detecting the presence of free particles, such as ceramic fragments, residual bonding leads, or solder balls (metallic particles), within cavity devices.
This test is a non-destructive test.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 4937.16-2025 |
| CCS | Semiconductor discrete devices |
| ICS | Integrated Components of Semiconductor Devices |
| Implement Date | 2026-05-01 |
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