GB/T 12333-2025 Active

This document specifies the marking, requirements, test methods, and sampling inspection for engineering copper electroplating layers on metal substrates.
This document applies to copper electroplating layers used in engineering applications, such as copper electroplating layers that act as a barrier on the surface of heat-treated parts, copper electroplating layers that serve as brazing layers during the welding of steel pipes, copper electroplating layers that reduce friction during drawing processing, copper electroplating layers used as a base layer for tin plating to prevent metal diffusion from the substrate, copper electroplating layers used for electromagnetic interference (EMI) shielding in electronic circuits, and copper electroplating layers for connectors.
This document does not apply to copper electroplating layers used for decorative purposes (surface plating) or as a base layer for other decorative plating, nor does it apply to electroformed copper.