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GB/T 4937.32-2023 Active
GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices(externally induced)
Abstract
This document applies to semiconductor devices (discrete devices and integrated circuits), hereinafter referred to as devices.
This document is used to determine whether devices burn due to external heating. This test uses a needle flame to simulate the effects of a small flame that may be caused by a device with components inside under fault conditions.
Note: Except for the additional content in this chapter and the addition of titles and renumbering in Chapters 2 and 4, this test method is consistent with the test method in Chapter 4, Section 1.2 of IEC 60749 (1996).
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 4937.32-2023 |
| CCS | Semiconductor discrete devices |
| ICS | Integrated Components of Semiconductor Devices |
| Implement Date | 2023-12-01 |
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