GB/T 4937.32-2023 Active National standards

GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices(externally induced)

GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices(externally induced)

Publish Date: 2023-05-23 Implement Date: 2023-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: GB/T 4937.32-2023
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Semiconductor discrete devices
ICS Name: Integrated Components of Semiconductor Devices
Publish Date: 2023-05-23
Implement Date: 2023-12-01
Pages: 6 pages

Scope

This document applies to semiconductor devices (discrete devices and integrated circuits), hereinafter referred to as devices.
This document is used to determine whether devices burn due to external heating. This test uses a needle flame to simulate the effects of a small flame that may be caused by a device with components inside under fault conditions.
Note: Except for the additional content in this chapter and the addition of titles and renumbering in Chapters 2 and 4, this test method is consistent with the test method in Chapter 4, Section 1.2 of IEC 60749 (1996).

Development Information

Word Count: 8 Thousand words Pages: 6 pages

Same series standard

Referenced Standards

Adopt standards

IEC 60749-32:2010

Related Standards

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