T/CIET 918-2024 Active Group standards

T/CIET 918-2024 Semiconductor power chip heat dissipation system technical specification

Publish Date: 2024-12-25 Implement Date: 2024-12-25 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Price: $ 20.00

Out of stock

Basic Information

Standard Code: T/CIET 918-2024

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Integrated Components of Semiconductor Devices

Publish Date: 2024-12-25

Implement Date: 2024-12-25

Scope

Scope: This document specifies the system composition, heat dissipation materials, installation requirements, inspection rules, and marking, packaging, transportation, and storage of the heat dissipation system for semiconductor power chips. This document applies to the heat dissipation system for semiconductor power chips. Main technical content: This document specifies the system composition, heat dissipation materials, installation requirements, inspection rules, and marking, packaging, transportation, and storage of the heat dissipation system for semiconductor power chips. This document applies to the heat dissipation system for semiconductor power chips.