T/QGCML 2655-2023 Active Group standards

T/QGCML 2655-2023 Metal-base heat dissipation type board-to-board connector

T/QGCML 2655-2023 Metal-base heat dissipation type board-to-board connector

Publish Date: 2023-12-14 Implement Date: 2023-12-29 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/QGCML 2655-2023
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: \nConnecting device
Publish Date: 2023-12-14
Implement Date: 2023-12-29
Pages: 8 pages

Scope

Main technical content: This document specifies the terms and definitions, structure and principle, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of metal substrate heat-dissipating cardboard connectors. This document is applicable to the production and inspection of metal substrate heat-dissipating cardboard connectors.

Development Information

Pages: 8 pages

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