DB35/T 1355-2013 Active Fujian ProvinceLocal standards

DB35/T 1355-2013 Halogen-free copper-clad epoxy fiberglass laminate board

DB35/T 1355-2013 Halogen-free copper-clad epoxy fiberglass laminate board

Publish Date: 2013-08-01 Implement Date: 2013-11-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: DB35/T 1355-2013
Standard Type: Local standards
Standard Status: Active
is_force_gb: no
CCS Name: Printed circuit board
ICS Name: Printed circuits and printed circuit boards
Publish Date: 2013-08-01
Implement Date: 2013-11-01
Pages: 20 pages

Scope

This standard specifies the terms and definitions, models, requirements, test methods, inspection rules, and markings, packaging, transportation, and storage of halogen-free copper-clad epoxy fiberglass laminates. This standard applies to halogen-free copper-clad epoxy fiberglass laminates (hereinafter referred to as halogen-free copper laminates) with bromine (Br) and chlorine (Cl) contents (by mass fraction) of less than 0.09% each, and a total bromine and chlorine content (by mass fraction) of less than 0.15%.

Development Information

Pages: 20 pages

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