T/HNNMIA 54-2023 Active Group standards

T/HNNMIA 54-2023 Gold-plated aluminum wire for packaging bonding

T/HNNMIA 54-2023 Gold-plated aluminum wire for packaging bonding

Publish Date: 2023-12-04 Implement Date: 2023-12-31 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/HNNMIA 54-2023
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: Lines, connections, and circuits
Publish Date: 2023-12-04
Implement Date: 2023-12-31

Scope

Main technical content: This document specifies the classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage, and order form (or contract) content of gold-plated aluminum wires used for device packaging and bonding (hereinafter referred to as "wire"). (Quality specification) This document is applicable to gold-plated aluminum wires used for device packaging and bonding (hereinafter referred to as "wire"). Table 2: Chemical Composition and Grade Chemical Composition Au/% All measurable impurities total/% Al/% AUAL05≥0.03≤0.01 Balance AUAL10≥0.05≤0.01 Balance AUAL15≥0.08≤0.01 Balance Table 3: Diameter Tolerance Diameter/mm Tolerance/mm 0.050±0.0004~-0.001 0.075±0.0004~-0.001 0.100±0.0008~-0.002 0.150±0.0008~-0.002 0.200±0.0008~-0.002 0.250±0.0008~-0.002 0.300±0.0010~-0.0025 0.380±0.0010~-0.0025 0.400±0.0010~-0.0025

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