T/CEMIA 037-2023 Active Group standards

T/CEMIA 037-2023 Specification for Ag/Pdconductor paste for thick film integrated circuits

Publish Date: 2023-11-14 Implement Date: 2023-12-30 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CEMIA 037-2023

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Electronic devices and specialized materials, parts, and structural components

ICS Name: Special materials for electronic technology

Publish Date: 2023-11-14

Implement Date: 2023-12-30

Pages: 16 pages

Scope

This document specifies the product classification, technical requirements, inspection methods, inspection rules, and packaging, marking, transportation, and storage of silver-palladium conductor pastes for thick-film integrated circuits. This document applies to silver-palladium conductor pastes for thick-film integrated circuits (hereinafter referred to as "silver-palladium conductor pastes"), which are composed of a conductive phase, a glass phase, an organic carrier, and additives and meet the printing requirements.

Development Information

Word Count: 19 Thousand words Pages: 16 pages

Referenced Standards

GB/T 17473.6-2008 Test methods of precious metals pastes used for microelectronics—Determination of resolution GB/T 17473.7-2022 Test methods of precious metals pastes used for microelectronics—Part 7:Determination of solderability and solder leaching resistance GJB 548C-2021 SJ/T 11512-2015 Electronic paste performance test methods for integrated circuits T/CEMIA 021-2019 Resistor paste specification for thick film integrated circuits

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