SJ 21332-2018 Active Industry standards-Electronics

SJ 21332-2018 Ceramic packages and metal packages Technical requirements for electroless nickel plating process

Publish Date: 2018-01-18 Implement Date: 2018-05-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: SJ 21332-2018

Standard Type: Industry standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: -

Publish Date: 2018-01-18

Implement Date: 2018-05-01

Pages: 13 pages

Scope

This standard specifies the requirements for the chemical nickel plating process of ceramic shells, metal shells, and porcelain parts used in microelectronics packaging. This standard applies to the chemical nickel plating process of ceramic shells, metal shells, and porcelain parts.

Development Information

Pages: 13 pages

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