T/CEIA 001-2023 Active Group standards

T/CEIA 001-2023 General Requirements for the Design of Solder Pads for Electronic Measuring Instruments and Components

T/CEIA 001-2023 Electronic measurement instrument component pad design general requirements

Publish Date: 2023-11-08 Implement Date: 2023-11-15 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CEIA 001-2023

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: Electronic components comprehensive

Publish Date: 2023-11-08

Implement Date: 2023-11-15

Scope

Scope: This document specifies the general requirements for the design of pads for electronic measurement instrument components. This document is applicable to the design of printed circuit boards for electronic measurement instruments. Main technical content: The main technical content covered in this document includes: 1) Requirements for optical reference points; 2) Design requirements for pads on structural components; 3) Design requirements for pads on via holes; 4) Design requirements for pads on through-hole mounted devices; 5) Design requirements for pads on surface-mounted devices; 6) Design requirements for pads on large-area copper foil; 7) Design requirements for solder resist layers, solder paste layers, and character layers.