T/HNNMIA 55-2023 Active Group standards

T/HNNMIA 55-2023 Micro-fine copper-tin alloy wire

T/HNNMIA 55-2023 Micro-fine copper-tin alloy wire

Publish Date: 2023-12-04 Implement Date: 2023-12-31 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/HNNMIA 55-2023
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: -
ICS Name: Electronic components and assemblies
Publish Date: 2023-12-04
Implement Date: 2023-12-31

Scope

Main technical content: This document specifies the classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, storage, and order form (or contract) content of fine copper-tin alloy wires. This document is applicable to fine copper-tin alloy wires (hereinafter referred to as wire materials). Table 2: Chemical Composition **Chemical Composition** **wtSn/%** **Total Measurable Impurities/%** **Cu/%** XTR10.27 ≤ Cu XTR1/ CuXTY1 ≤ 0.32 ≤ 0.05 Balance XTY1 ≤ 0.05 Balance XTR20 ≤ Cu XTR2/ CuXTY2 ≤ 0.62 ≤ 0.05 Balance XTY2 ≤ 0.05 Balance XTR30 ≤ Cu XTR2/ CuXTY2 ≤ 0.82 ≤ 0.05 Balance XTY3 ≤ 0.05 Balance Table 3: Diameter Tolerances **Diameter/mm** **Tolerance/mm** 0.012–0.020 ± 0.0015 0.021–0.025 ± 0.0020 0.026–0.125 ± 0.003 0.126–0.400 ± 0.004 0.401–1.170 ± 1% **Note**: When calculating, diameters between 0.401mm and 1.000mm are rounded to three decimal places; diameters greater than 1.000mm are rounded to two decimal places, all in accordance with the relevant provisions of GB/T 8170-2008.

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