GB/T 42576-2023
Active
GB/T 43021-2023
Active
National standards
GB/T 43021-2023 Workmanship requirements for rework,modification and repair of soldered electronic assemblies
GB/T 43021-2023 Workmanship requirements for rework,modification and repair of soldered electronic assemblies
Basic Information
Standard Code:
GB/T 43021-2023
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Electronic device mechanical structural parts
ICS Name:
Electronic components and assemblies
Publish Date:
2023-09-07
Implement Date:
2024-02-01
Publisher:
国家市场监督管理总局、国家标准化管理委员会
Technical Committee:
全国印制电路标准化技术委员会(SAC/TC 47)
Pages:
29 pages
Scope
本文件规定了适用于电子组装件焊接的返工、改装和返修的内容和工艺要求。
本文件适用于将元器件与印制板和最终产品相关部件连接的电子组装件焊接制造过程中的返工、改装和返修，也适用于混合安装技术产品组装中的相关作业活动。
本文件也包括与返工相关的设计内容的指南。
注：在不引起混淆的情况下，本文件中的“返工操作”适用于返工、改装和返修。仅适用于返工的操作会以“返工操作（仅适用返工）”表示。
Development Information
Drafting Units:
中国航天科技集团有限公司第九研究院二厂、中国电子技术标准化研究院、中国电子科技集团公司第十五研究所
Drafting Persons:
暴杰、赵钺、王轶、王丽娜、曹易、郭晓宇
Referenced Standards
GB/T 19247.1-2003 Printed board assemblies—Part 1:Generic specification—Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
GB/T 19247.2-2003 Printed board assemblies—Part 2:Sectional specification—Requirements for surface mount soldered assemblies
GB/T 19247.3-2003 Printed board assemblies—Part 3:Sectional specification-Requirements for through-hole mount soldered assemblies
GB/T 19247.4-2003 Printed board assemblies—Part 4:Sectional specification-Requirements for terminal soldered assemblies
GB/T 2036-1994 Terms for printed circuits
GB/T 4725-1992 Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
GB/T 4725-2022 Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
GB/T 31474-2015 Soldering fluxes for high-quality interconnections in electronics assembly
GB/T 31475-2015 Requirements for solder paste for high-quality interconnections in electronics assembly
GB/T 31476-2015 Requirements for solders for high-quality interconnections in electronics assembly
GB/T 33772.1-2017 Quality assessment systems—Part 1:Registration and analysis of defects on printed board assemblies
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