GB/T 43021-2023 Active National standards

GB/T 43021-2023 Workmanship requirements for rework,modification and repair of soldered electronic assemblies

GB/T 43021-2023 Workmanship requirements for rework,modification and repair of soldered electronic assemblies

Publish Date: 2023-09-07 Implement Date: 2024-02-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: GB/T 43021-2023

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Electronic device mechanical structural parts

ICS Name: Electronic components and assemblies

Publish Date: 2023-09-07

Implement Date: 2024-02-01

Pages: 29 pages

Scope

This document specifies the content and process requirements for rework, modification, and repair of electronic assemblies during welding.
This document applies to the rework, modification, and repair of electronic assemblies during the welding process of components connected to printed circuit boards and related components of final products, as well as to related work activities in the assembly of products using mixed mounting technologies.
This document also includes guidelines for design content related to rework.
Note: To avoid confusion, the term "rework operations" in this document applies to rework, modification, and repair. Operations applicable only to rework will be indicated as "rework operations (applicable to rework only)".

Development Information

Word Count: 58 Thousand words Pages: 29 pages

Referenced Standards

GB/T 19247.1-2003 Printed board assemblies—Part 1:Generic specification—Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies GB/T 19247.2-2003 Printed board assemblies—Part 2:Sectional specification—Requirements for surface mount soldered assemblies GB/T 19247.3-2003 Printed board assemblies—Part 3:Sectional specification-Requirements for through-hole mount soldered assemblies GB/T 19247.4-2003 Printed board assemblies—Part 4:Sectional specification-Requirements for terminal soldered assemblies GB/T 2036-1994 Terms for printed circuits GB/T 4725-1992 Epoxide woven glass fabric copper-clad laminated sheets for printed circuits GB/T 4725-2022 Epoxide woven glass fabric copper-clad laminated sheets for printed circuits GB/T 31474-2015 Soldering fluxes for high-quality interconnections in electronics assembly GB/T 31475-2015 Requirements for solder paste for high-quality interconnections in electronics assembly GB/T 31476-2015 Requirements for solders for high-quality interconnections in electronics assembly GB/T 33772.1-2017 Quality assessment systems—Part 1:Registration and analysis of defects on printed board assemblies

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