T/TMAC 371-2026 Active Group standards

T/TMAC 371-2026 High-precision dark field scanning wafer defect detection equipment

T/TMAC 371-2026 High-precision dark field scanning wafer defect detection equipment

Publish Date: 2026-03-30 Implement Date: 2026-03-30 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/TMAC 371-2026
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: Medical electronic instruments and equipment
ICS Name: Integrated Components of Semiconductor Devices
Publish Date: 2026-03-30
Implement Date: 2026-03-30

Scope

This document is applicable to equipment used for the automated dark-field detection of micron-level and sub-micron-level surface defects on silicon wafers and compound semiconductor wafers. This document specifies the technical requirements, test methods, inspection rules, and marking, packaging, transportation, and storage for high-precision dark-field scanning wafer defect detection equipment.

Development Information

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