T/DGECA 034-2025 Abolished Group standards

T/DGECA 034-2025 High-performance wafer technology requirements based on integrated circuits

Publish Date: 2025-11-10 Implement Date: 2025-11-20 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/DGECA 034-2025

Standard Type: Group standards

Standard Status: Abolished

is_force_gb: no

CCS Name: Medical electronic instruments and equipment

ICS Name: Integrated Components of Semiconductor Devices

Publish Date: 2025-11-10

Implement Date: 2025-11-20

Scope

This document specifies the production process, technical requirements, testing methods, inspection rules, and marking, packaging, transportation, and storage of high-performance wafers used in integrated circuits. This document applies to silicon single-crystal wafers (hereinafter referred to as "wafers") manufactured by the direct-pulling method and used in advanced integrated circuit manufacturing, primarily for the fabrication of high-performance computing chips such as logic and memory. Other semiconductor materials (such as SiC and GaN) or wafers used in other fields can be referenced for use.