T/ZZB 1718-2020 Active Group standards

T/ZZB 1718-2020 Gold wire for semiconductor packaging

Publish Date: 2020-09-30 Implement Date: 2020-10-30 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/ZZB 1718-2020

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Precious metals and their alloys

ICS Name: Other non-ferrous metal products

Publish Date: 2020-09-30

Implement Date: 2020-10-30

Scope

Main technical content: This standard specifies the basic requirements, product classification and marking, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage, quality certificates, and quality commitments for bonding wires used in semiconductor packaging (hereinafter referred to as bonding wires). This standard applies to bonding wires used in semiconductor discrete devices, integrated circuits, and LED packaging.