GB/T 46280.5-2025 Active National standards

GB/T 46280.5-2025 Specification for chiplet interconnection interface—Part 5:Physical layer technical requirements based on 2.5D package

Publish Date: 2025-08-19 Implement Date: 2026-03-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: GB/T 46280.5-2025

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Microcircuit

ICS Name: Integrated circuits, microelectronics

Publish Date: 2025-08-19

Implement Date: 2026-03-01

Pages: 44 pages

Scope

This document specifies the technical requirements of the physical layer based on 2.5D packaging, including initialization and training processes, electrical characteristics of the physical layer, redundancy mechanisms, physical interface layout, and technical requirements related to low-power control.
This document is applicable to the design, manufacturing, and application of core-package interconnect interfaces.

Development Information

Word Count: 71 Thousand words Pages: 44 pages

Same series standard

GB/T 46280.1-2025 Specification for chiplet interconnection interface—Part 1:General principles GB/T 46280.2-2025 Specification for chiplet interconnection interface—Part 2:Protocol layer technical requirements GB/T 46280.3-2025 Specification for chiplet interconnection interface—Part 3:Datalink layer technical requirements GB/T 46280.4-2025 Specification for chiplet interconnection interface—Part 4:Physical layer technical requirements based on 2D package

Referenced Standards

GB/T 46280.1-2025 Specification for chiplet interconnection interface—Part 1:General principles GB/T 46280.3-2025 Specification for chiplet interconnection interface—Part 3:Datalink layer technical requirements

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