T/CPCA 4308-2014 Active Group standards

T/CPCA 4308-2014 Copper sulfate used for plating manufacturing

T/CPCA 4308-2014 Copper sulfate used for plating manufacturing

Publish Date: 2014-07-11 Implement Date: 2014-09-18 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/CPCA 4308-2014
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: Inorganic chemical raw materials
ICS Name: Salt
Publish Date: 2014-07-11
Implement Date: 2014-09-18

Scope

This standard specifies the requirements for copper sulfate (i.e., copper sulfate pentahydrate [II]) used in the electroplating of printed circuit boards, including test methods, inspection rules, marking, labeling, packaging, transportation, and storage. This standard applies to copper sulfate used in the electroplating of printed circuit boards. This product is mainly used for copper electroplating and chemical copper plating. 1. Resolve the differences in the content and impurities of first-grade and high-purity copper sulfate used in the electroplating of printed circuit boards. 2. Solve the analysis errors and reproducibility issues of the copper sulfate content detection using volumetric analysis (arbitration method) and automatic potentiometric titration (rapid method). (Error analysis of experimental results is required.)

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