GB/T 7124-1986
Replaced
T/CIET 765-2024
Active
Group standards
T/CIET 765-2024 Semiconductor Chip Packaging Thermal Conductive Organic Silicone Gel
T/CIET 765-2024
Price:
$ 20.00
Basic Information
Standard Code:
T/CIET 765-2024
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Adhesives and adhesive products
Publish Date:
2024-11-06
Implement Date:
2024-11-06
Scope
Scope: This document specifies the basic requirements, test methods, inspection rules, marking, packaging, transportation, and storage of heat-conductive silicone gels for semiconductor chip packaging. This document is applicable to heat-conductive silicone gels for semiconductor chip packaging. Main technical content: This document specifies the basic requirements, test methods, inspection rules, marking, packaging, transportation, and storage of heat-conductive silicone gels for semiconductor chip packaging. This document is applicable to heat-conductive silicone gels for semiconductor chip packaging.
Development Information
Related Standards
GB/T 7749-1987
Active
GB/T 7749-1987 Test method of cleavage strength of adhesive (metal to metal)
GB/T 7750-1987
Active
GB/T 7750-1987 Test method of creep properties of adhesive in shear by tension loading (metal to metal)
GB/T 11177-1989
Active
GB/T 11177-1989 Testing method for compressive shear strength of dowel joint by inorganic adhesives
GB/T 12216-1990
Abolished
GB/T 12216-1990 The residue from distillation of synthetic fatty acids as binder for foundry
GB/T 13353-1992
Active