T/ZSA 268-2024 Active Group standards

T/ZSA 268-2024 Low temperature solder welding process and usage requirements

T/ZSA 268-2024 Low temperature solder welding process and usage requirements

Publish Date: 2024-11-27 Implement Date: 2024-11-28 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/ZSA 268-2024
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: Electronic components and information technology
ICS Name: \nWelding process
Publish Date: 2024-11-27
Implement Date: 2024-11-28

Scope

Scope: This document specifies the technical requirements, test methods, process requirements, management methods, and welding finished product marking and packaging for low-temperature solder paste used in surface mount technology (SMT) applications. This document is applicable to low-temperature solder paste used in SMT applications. Main technical content: This document specifies the technical requirements, test methods, process requirements, management methods, and welding finished product marking and packaging for low-temperature solder paste used in surface mount technology (SMT) applications. This document is applicable to low-temperature solder paste used in SMT applications.

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