GB/T 14824-1993
Replaced
T/CIET 917-2024
Active
Group standards
T/CIET 917-2024 Chip cooling structure and cooling method
T/CIET 917-2024 Chip cooling structure and cooling method
Price:
$ 20.00
Basic Information
Standard Code:
T/CIET 917-2024
Standard Type:
Group standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
Other electrical devices
Publish Date:
2024-12-25
Implement Date:
2024-12-25
Scope
Scope: This document specifies the design requirements, manufacturing requirements, performance testing, and heat dissipation methods for chip cooling structures. This document is applicable to chip cooling in various electronic devices, particularly for high-power chips and applications with high cooling requirements and complex cooling environments, such as servers, high-performance computers, communication base station equipment, industrial control devices, etc. Main technical content: This document specifies the design requirements, manufacturing requirements, performance testing, and heat dissipation methods for chip cooling structures. This document is applicable to chip cooling in various electronic devices, particularly for high-power chips and applications with high cooling requirements and complex cooling environments, such as servers, high-performance computers, communication base station equipment, industrial control devices, etc.
Development Information
Related Standards
GB 16895.3-1997
Replaced
GB 16895.3-1997 Electrical installations of buildings Part 5:Selection and erection of electrical equipment Chapter 54:Earthing arrangements and protective conductors
GB 17885-1999
Replaced
GB 17885-1999 Electromechanical contactors for household and similar purposes
GB/T 5588-2002
Replaced
GB/T 5588-2002 Technical specification for silver-nickel,silver-iron electrical contacts
GB/T 19637-2005
Replaced
GB/T 19637-2005 Electrical accessories—Cable reels for household and similar purposes
GB/T 17045-2006
Replaced