T/SBX 021-2019 Active Group standards

T/SBX 021-2019 Laser chip automatic scribing and splitting operation procedures

Publish Date: 2019-11-25 Implement Date: 2019-12-15 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/SBX 021-2019

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Electronic components and information technology

ICS Name: Optoelectronics, laser equipment

Publish Date: 2019-11-25

Implement Date: 2019-12-15

Scope

Main technical content: This specification stipulates the requirements for personnel, equipment, materials, and environmental conditions of the chip dicing process, as well as the process operating procedures. This specification is applicable to the dicing process.