T/JSSIA 0004-2017 Active Group standards

T/JSSIA 0004-2017 Wafer-Level Chip Scale Package (WLCSP) Outline Dimensions

T/JSSIA 0004-2017

Publish Date: 2017-09-29 Implement Date: 2017-10-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: T/JSSIA 0004-2017
Standard Type: Group standards
Standard Status: Active
is_force_gb: no
CCS Name: Microcircuit
ICS Name: Integrated circuits, microelectronics
Publish Date: 2017-09-29
Implement Date: 2017-10-01

Scope

Scope: This standard applies to the dimensional inspection of finished devices of wafer-level chip size packaging (WLCSP); Main technical content: This standard specifies the external dimensions of wafer-level chip size packaging (WLCSP), and is applicable to the dimensional inspection of finished devices of wafer-level chip size packaging (WLCSP).

Development Information

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