T/JSQA 140-2022 High-density interconnect multilayer printed circuit board
T/JSQA 140-2022 High-density interconnect multilayer printed circuit board
Basic Information
Scope
Scope: This document specifies the terms and definitions, product classification, requirements, test methods, inspection rules, marking, packaging, transportation, and storage of high-density interconnected multilayer printed circuit boards, hereinafter referred to as PCBs. This document is applicable to high-density interconnected multilayer printed circuit boards, hereinafter referred to as PCBs. Main technical content: This group standard specifies the terms and definitions, product classification, requirements, test methods, inspection rules, and marking, packaging, transportation, and storage of high-density interconnected multilayer printed circuit boards. The technical requirements specify dimensional tolerances, appearance quality, electrical performance, physical performance, mechanical performance, and environmental performance. The dimensional tolerances and appearance quality are determined according to the actual situation of the company. The electrical performance, physical performance, mechanical performance, and environmental performance are determined in accordance with the relevant requirements of the industry standard IPC-6012E-2020 "Identification and Performance Specifications for Rigid Printed Boards".