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GB/T 32280-2015
GB/T 32280-2015 Test method for warp of silicon wafers—Automated non-contact scanning method
Abstract
This standard specifies a non-destructive, automatic non-contact scanning test method for the warpage of silicon wafers. This standard is applicable to the warpage test of clean and dry silicon wafers with a diameter of not less than 50 mm and a thickness of not less than 100 μm, which have undergone cutting, grinding, corrosion, polishing, etching, epitaxy, or other surface treatments. This method can be used to monitor the warpage of silicon wafers caused by thermal effects and/or mechanical effects, and can also be used for the warpage test of other semiconductor wafers such as gallium arsenide and sapphire.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Replaced |
| Standard Code | GB/T 32280-2015 |
| CCS | \nTest methods for the physical properties of metals |
| ICS | \nMetal material testing |
| Implement Date | 2017-01-01 |
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