GB/T 32280-2015 Replaced National standards

GB/T 32280-2015 Test method for warp of silicon wafers—Automated non-contact scanning method

GB/T 32280-2015 Test method for warp of silicon wafers—Automated non-contact scanning method

Publish Date: 2015-12-10 Implement Date: 2017-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 32280-2015
Standard Type: National standards
Standard Status: Replaced
is_force_gb: no
CCS Name: \nTest methods for the physical properties of metals
ICS Name: \nMetal material testing
Publish Date: 2015-12-10
Implement Date: 2017-01-01
Pages: 12 pages

Scope

This standard specifies a non-destructive, automatic non-contact scanning test method for the warpage of silicon wafers. This standard is applicable to the warpage test of clean and dry silicon wafers with a diameter of not less than 50 mm and a thickness of not less than 100 μm, which have undergone cutting, grinding, corrosion, polishing, etching, epitaxy, or other surface treatments. This method can be used to monitor the warpage of silicon wafers caused by thermal effects and/or mechanical effects, and can also be used for the warpage test of other semiconductor wafers such as gallium arsenide and sapphire.

Development Information

Word Count: 22 Thousand words Pages: 12 pages

Superseded by the following standards

Referenced Standards

Related Standards

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