GB/T 6620-2009 Active
GB/T 6620-2009 Test method for measuring warp on silicon slices by noncontact scanning
Abstract
This standard specifies a non-contact testing method for the warpage of silicon monocrystalline cutting slices, grinding slices, and polishing slices (hereinafter referred to as silicon slices). This standard is applicable to the measurement of circular silicon slices with a diameter greater than 50 mm and a thickness greater than 180 μm. This standard is also applicable to the measurement of the warpage of other semiconductor slices. The purpose of this testing method is to be used for incoming material inspection or process control. This testing method is also applicable to monitoring the thermochemical effects of silicon slice warpage during device processing.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 6620-2009 |
| CCS | Element semiconductor materials |
| ICS | Semiconductor materials |
| Implement Date | 2010-06-01 |