GB/T 4937.14-2018 Active
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity）
Abstract
This part of GB/T 4937 specifies several different test methods for determining the firmness of lead/encapsulation interfaces and leads. This test is conducted when lead bending occurs due to circuit board assembly errors, and the leads need to be reshaped for reassembly. For hermetically sealed devices, it is recommended to conduct a sealing test according to IEC 60749-8 after this test to determine whether the stress applied to the lead terminals has a negative impact on the sealing.
Each test condition in this part is destructive and is only suitable for qualification testing.
This part applies to all through-hole mounting devices and surface-mounting devices that require users to perform lead shaping processing.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 4937.14-2018 |
| CCS | Semiconductor discrete devices |
| ICS | Integrated Components of Semiconductor Devices |
| Implement Date | 2019-01-01 |