GB/T 4937.14-2018 Active National standards

GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity）

GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity）

Publish Date: 2018-09-17 Implement Date: 2019-01-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 4937.14-2018

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Semiconductor discrete devices

ICS Name: Integrated Components of Semiconductor Devices

Publish Date: 2018-09-17

Implement Date: 2019-01-01

Pages: 13 pages

Scope

This part of GB/T 4937 specifies several different test methods for determining the firmness of lead/encapsulation interfaces and leads. This test is conducted when lead bending occurs due to circuit board assembly errors, and the leads need to be reshaped for reassembly. For hermetically sealed devices, it is recommended to conduct a sealing test according to IEC 60749-8 after this test to determine whether the stress applied to the lead terminals has a negative impact on the sealing.
Each test condition in this part is destructive and is only suitable for qualification testing.
This part applies to all through-hole mounting devices and surface-mounting devices that require users to perform lead shaping processing.

Development Information

Word Count: 24 Thousand words Pages: 13 pages

Same series standard

GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12:Vibration,variable frequency GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17:Neutron irradiation GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18:Ionizing radiation(total dose) GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20:Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21:Solderability GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30:Preconditioning of non-hermetic surface mount devices prior to reliability testing GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1:Handling,packing,labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Referenced Standards

IEC 60749-8

Adopt standards

IEC 60749-14:2003

Related Standards

GB/T 14264-1993 Replaced

GB/T 14264-1993 Semiconductor materials—Terms and definitions

Publish Date: 1993-03-12

GB/T 14844-1993 Replaced

GB/T 14844-1993 Designations of semiconductor materials

Publish Date: 1993-12-24

GB/T 17573-1998 Active

GB/T 17573-1998 Semiconductor devices Discrete devices and integrated circuits Part 1:General

Publish Date: 1998-11-17

GB/T 12560-1999 Active

GB/T 12560-1999 Semiconductor devices Sectional specification for discrete devices

Publish Date: 1999-08-02

GB/T 11499-2001 Active

GB/T 11499-2001 Letter symbols for discrete semiconductor devices

Publish Date: 2001-11-05

GB/T 20521-2006 Active

GB/T 20521-2006 Semiconductor devices—Part 14-1:Semiconductor sensors—General and classification

Publish Date: 2006-08-23