T/BIE 004-2023 Active
T/BIE 004-2023 Through-hole reflow soldering technical specification standard group standard
Abstract
Scope: This document specifies the general requirements for high-quality electronic assembly using through-hole reflow soldering technology on printed circuit boards, and describes the related standard requirements for components, printed circuit boards, and stencil design, as well as the test conditions and methods for component and assembly-related tests. This document specifies the basic matters, process conditions, inspection criteria, and general specifications for through-hole reflow soldering on printed circuit boards; Main technical content: General requirements for through-hole reflow soldering; Shape and design of components for through-hole reflow soldering; Design of printed circuit boards for through-hole reflow soldering; Process specifications for through-hole reflow soldering; Acceptable judgment criteria for electronic assemblies subjected to through-hole reflow soldering; Typical defect examples of through-hole reflow soldering; Stencil design guidelines; Tolerance of terminal positions and hole matching, as well as related test and specification requirements for through-hole reflow soldering components.
General Product Information
| Document Type | Group standards |
|---|---|
| Standard Status | Active |
| Standard Code | T/BIE 004-2023 |
| ICS | Electronic components comprehensive |
| Implement Date | 2023-12-06 |