T/CSTM 00993-2023 Active
T/CSTM 00993-2023 Communication Materials Key Performance and Batch Consistency Evaluation Guide
Abstract
Scope: This document specifies the batch consistency evaluation methods for communication-related materials such as rigid copper clad laminates, LCP/MPI flexible copper clad laminates, LTCC substrate materials, solder paste materials, thermal insulation pads, and conformal coating materials. This document is applicable to the critical performance consistency evaluation of rigid copper clad laminates, LCP/MPI flexible copper clad laminates, LTCC substrate materials, solder paste materials, thermal insulation pads, and conformal coating materials for new communication products, new processes, and new applications during their industrialization phase. Main technical content: This document specifies the batch consistency evaluation methods for communication-related materials such as rigid copper clad laminates, LCP/MPI flexible copper clad laminates, LTCC substrate materials, solder paste materials, thermal insulation pads, and conformal coating materials. This document is applicable to the critical performance consistency evaluation of rigid copper clad laminates, LCP/MPI flexible copper clad laminates, LTCC substrate materials, solder paste materials, thermal insulation pads, and conformal coating materials for new communication products, new processes, and new applications during their industrialization phase.
General Product Information
| Document Type | Group standards |
|---|---|
| Standard Status | Active |
| Standard Code | T/CSTM 00993-2023 |
| CCS | Printed circuit board |
| ICS | Printed circuits and printed circuit boards |
| Implement Date | 2023-09-12 |