T/CSTM 00993-2023 Active Group standards

T/CSTM 00993-2023 Communication Materials Key Performance and Batch Consistency Evaluation Guide

Publish Date: 2023-06-12 Implement Date: 2023-09-12 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: T/CSTM 00993-2023

Standard Type: Group standards

Standard Status: Active

is_force_gb: no

CCS Name: Printed circuit board

ICS Name: Printed circuits and printed circuit boards

Publish Date: 2023-06-12

Implement Date: 2023-09-12

Pages: 12 pages

Scope

Scope: This document specifies the batch consistency evaluation methods for communication-related materials such as rigid copper clad laminates, LCP/MPI flexible copper clad laminates, LTCC substrate materials, solder paste materials, thermal insulation pads, and conformal coating materials. This document is applicable to the critical performance consistency evaluation of rigid copper clad laminates, LCP/MPI flexible copper clad laminates, LTCC substrate materials, solder paste materials, thermal insulation pads, and conformal coating materials for new communication products, new processes, and new applications during their industrialization phase. Main technical content: This document specifies the batch consistency evaluation methods for communication-related materials such as rigid copper clad laminates, LCP/MPI flexible copper clad laminates, LTCC substrate materials, solder paste materials, thermal insulation pads, and conformal coating materials. This document is applicable to the critical performance consistency evaluation of rigid copper clad laminates, LCP/MPI flexible copper clad laminates, LTCC substrate materials, solder paste materials, thermal insulation pads, and conformal coating materials for new communication products, new processes, and new applications during their industrialization phase.