PDF
GB/T 44687-2024 Active
GB/T 44687-2024 Superabrasive products—Precision grinding wheels for semiconductor wafers
Abstract
This document specifies the product classification, product marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of grinding wheels used for precision grinding of semiconductor wafers.
This document is applicable to metal bonded, resin bonded, and ceramic bonded diamond grinding wheels, as well as their composite bonded diamond grinding wheels, used for precision grinding of semiconductor wafer edges and precision grinding of wafer end faces for thinning purposes.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 44687-2024 |
| CCS | Abrasives and abrasive tools |
| ICS | Abrasives and grinding tools |
| Implement Date | 2025-04-01 |
Price
$ 84
Subtotal
$ 84
Tax
$ 0.00
Order Total (incl. tax)
$ 84