GB/T 44687-2024 Active National standards

GB/T 44687-2024 Superabrasive products—Precision grinding wheels for semiconductor wafers

GB/T 44687-2024 Superabrasive products—Precision grinding wheels for semiconductor wafers

Publish Date: 2024-09-29 Implement Date: 2025-04-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: GB/T 44687-2024
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Abrasives and abrasive tools
ICS Name: Abrasives and grinding tools
Publish Date: 2024-09-29
Implement Date: 2025-04-01
Pages: 28 pages

Scope

This document specifies the product classification, product marking, technical requirements, test methods, inspection rules, marking, packaging, transportation, and storage of grinding wheels used for precision grinding of semiconductor wafers.
This document is applicable to metal bonded, resin bonded, and ceramic bonded diamond grinding wheels, as well as their composite bonded diamond grinding wheels, used for precision grinding of semiconductor wafer edges and precision grinding of wafer end faces for thinning purposes.

Development Information

Word Count: 37 Thousand words Pages: 28 pages

Referenced Standards

Related Standards

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