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GB/T 8446.2-2022 Active
GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2:Measurement methods of thermal resistance andinlet-outlet fluid pressure drop
Abstract
This document provides the terminology and definitions of thermal resistance and flow resistance for heat sinks used in power semiconductor devices, as well as measurement methods.
This document is applicable to the measurement of thermal resistance and flow resistance for heat sinks used in power semiconductor devices, including cast, extruded, profile, and heat pipe heat sinks.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 8446.2-2022 |
| CCS | Power semiconductor devices and components |
| ICS | Integrated Electromechanical Components |
| Implement Date | 2022-10-01 |
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