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GB/T 32278-2015
GB/T 32278-2015 Test method for flatness of monocrystalline silicon carbide wafers
Abstract
This standard specifies the flatness of silicon carbide single-crystal polished wafers, including the test methods for total thickness variation (TTV), local thickness variation (LTV), bow, and warp. This standard is applicable to the flatness testing of silicon carbide single-crystal polished wafers with diameters of 50.8 mm, 76.2 mm, and 100 mm, and thicknesses ranging from 0.13 mm to 1 mm.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Replaced |
| Standard Code | GB/T 32278-2015 |
| CCS | \nTest methods for the physical properties of metals |
| ICS | \nMetal material testing |
| Implement Date | 2017-01-01 |
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