PDF
YS/T 1105-2016
YS/T 1105-2016 Silver bonding wire for semiconductor package
Abstract
This standard specifies the requirements, test methods, inspection rules, marking, packaging, transportation, storage, quality certificates, and purchase orders (or contracts) for bonding silver wires used in the packaging of semiconductor discrete devices, integrated circuits, and LEDs. This standard applies to bonding silver wires used in semiconductor packaging.
General Product Information
| Document Type | Industry standards-Non-ferrous metals |
|---|---|
| Standard Status | Abolished |
| Standard Code | YS/T 1105-2016 |
| CCS | Precious metals and their alloys |
| ICS | Other non-ferrous metal products |
| Implement Date | 2016-09-01 |
Price
$ 18.00
Subtotal
$ 18.00
Tax
$ 0.00
Order Total (incl. tax)
$ 18.00