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GB/T 4937.19-2018 Active
GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength
Abstract
This part of GB/T 4937 is used to determine the integrity of the materials and process steps used to install semiconductor chips on lead frames or other substrates (for the purposes of this test method, semiconductor chips in this part include passive components). This part is applicable to cavity packaging and can also be used for process monitoring. It is not suitable for chips with an area greater than 10 mm2, as well as flip-chip chips and easily bendable substrates.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 4937.19-2018 |
| CCS | Semiconductor discrete devices |
| ICS | Integrated Components of Semiconductor Devices |
| Implement Date | 2019-01-01 |
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