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GB/T 4937.22-2018 Active
GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength
Abstract
This part of GB/T 4937 is applicable to semiconductor devices (discrete devices and integrated circuits).
The purpose of this part is to measure the bonding strength or determine whether the bonding strength meets the specified requirements.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 4937.22-2018 |
| CCS | Semiconductor discrete devices |
| ICS | Integrated Components of Semiconductor Devices |
| Implement Date | 2019-01-01 |
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