GB/T 4909.12-2009 Active
GB/T 4909.12-2009 Test methods for bare wires—Part 12:Solderability test of coating—Solder globule method
Abstract
This part of GB/T 4909 specifies the test equipment, sample preparation, measurement steps, test results, and evaluation for the weldability of coatings on bare wires using the solder ball method.
This part is applicable to testing the wettability of tin-plated copper wires by molten solder, which is expressed in a specific time.
The method in this part is to use a sample to divide the solder ball in half, and measure the time required for the solder to flow to the edges of the sample and cover the sample after the solder ball is cut open. This time indicates the weldability of the sample.
This part should be used in conjunction with GB/T 4909.1—2009.
General Product Information
| Document Type | National standards |
|---|---|
| Standard Status | Active |
| Standard Code | GB/T 4909.12-2009 |
| CCS | \nBare wires |
| ICS | Wire |
| Implement Date | 2009-12-01 |