GB/T 4909.12-2009 Active National standards

GB/T 4909.12-2009 Test methods for bare wires—Part 12:Solderability test of coating—Solder globule method

GB/T 4909.12-2009 Test methods for bare wires—Part 12:Solderability test of coating—Solder globule method

Publish Date: 2009-03-19 Implement Date: 2009-12-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 4909.12-2009
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: \nBare wires
ICS Name: Wire
Publish Date: 2009-03-19
Implement Date: 2009-12-01
Pages: 8 pages

Scope

This part of GB/T 4909 specifies the test equipment, sample preparation, measurement steps, test results, and evaluation for the weldability of coatings on bare wires using the solder ball method.
This part is applicable to testing the wettability of tin-plated copper wires by molten solder, which is expressed in a specific time.
The method in this part is to use a sample to divide the solder ball in half, and measure the time required for the solder to flow to the edges of the sample and cover the sample after the solder ball is cut open. This time indicates the weldability of the sample.
This part should be used in conjunction with GB/T 4909.1—2009.

Development Information

Word Count: 14 Thousand words Pages: 8 pages

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