GB/T 15678-1995
Replaced
GB/T 8750-2014
Replaced
National standards
GB/T 8750-2014 Gold bonding wire for semiconductor package
GB/T 8750-2014 Gold bonding wire for semiconductor package
Basic Information
Standard Code:
GB/T 8750-2014
Standard Type:
National standards
Standard Status:
Replaced
is_force_gb:
no
CCS Name:
Precious metals and their alloys
ICS Name:
Other non-ferrous metal products
Publish Date:
2014-07-24
Implement Date:
2015-02-01
Pages:
23 pages
Scope
This standard specifies the requirements, test methods, inspection rules, marking, packaging, transportation and storage, quality certificates, contracts (or purchase orders), etc. for bonding wires used in the packaging of semiconductor discrete devices, integrated circuits, and LEDs.
This standard applies to bonding wires used in semiconductor packaging.
Development Information
Replace the following standards
Superseded by the following standards
Referenced Standards
GB/T 10573-1989 Tensile testing method for fine wire of non-ferrous metals
GB/T 10573-2020 Tensile testing method for fine wire of nonferrous metals
GB/T 11066.5-1989 Gold—Determination of silver, copper, iron, lead, antimony and bismuth contents—Emission spectrometric method
GB/T 11066.5-2008 Methods for chemical analysis of gold—Determination of silver,copper,iron,lead,antimony and bismuth contents—Atomic emission spectrometry
GB/T 15077-1994 Geometric size measuring methods of precious metals and their alloy materials
GB/T 15077-2008 Geometric size measuring methods of precious metals and their alloy materials
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GB/T 9967-2001
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