GB/T 4855-1984
Abolished
GB/T 28277-2012
Active
National standards
GB/T 28277-2012 Silicon-based MEMS fabrication technology—Measurement method of cutting and pull-press strength of micro bonding area
GB/T 28277-2012 Silicon-based MEMS fabrication technology—Measurement method of cutting and pull-press strength of micro bonding area
Basic Information
Standard Code:
GB/T 28277-2012
Standard Type:
National standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
Microcircuit
ICS Name:
Integrated circuits, microelectronics
Publish Date:
2012-05-11
Implement Date:
2012-12-01
Pages:
19 pages
Scope
This standard specifies the requirements and test methods for detecting the bonding strength of micro bonding areas involved in the processing of silicon-based MEMS.
This standard is applicable to the shear and tensile strength tests of micro bonding areas manufactured using microelectronics processes and related fine processing technologies.
Development Information
Referenced Standards
Related Standards
GB/T 3434-1986
Abolished
GB/T 3434-1986 Families and products of ECL circuits for semiconductor integrated circuits
GB/T 3431.2-1986
Active
GB/T 3431.2-1986 Letter symbols for semiconductor integrated circuits—Letter symbols for function of pins
GB/T 6648-1986
Active
GB/T 6648-1986 Blank detail specification for semiconductor integrated circuit static read/write memories
GB/T 6800-1986
Abolished
GB/T 6800-1986 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits
GB/T 3435-1987
Abolished