GB/T 4937.35-2024 Active National standards

GB/T 4937.35-2024 Semiconductor devices—Mechanical and climatic test methods—Part 35:Acoustic microscopy for plastic encapsulated electronic components

Publish Date: 2024-03-15 Implement Date: 2024-07-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

Basic Information

Standard Code: GB/T 4937.35-2024

Standard Type: National standards

Standard Status: Active

is_force_gb: no

CCS Name: Semiconductor discrete devices

ICS Name: Integrated Components of Semiconductor Devices

Publish Date: 2024-03-15

Implement Date: 2024-07-01

Publisher: 国家市场监督管理总局、国家标准化管理委员会

Technical Committee: 中华人民共和国工业和信息化部

Pages: 24 pages

Scope

本文件规定了塑封电子元器件进行声学显微镜检查的程序。本文件提供了一种使用声学显微镜对塑料封装进行缺陷（分层、裂纹、模塑料空洞等）检查的方法，本方法具有可重复性，是非破坏性试验。

Development Information

Drafting Units:

中国电子科技集团公司第十三研究所

Drafting Persons:

裴选、赵海龙、彭浩、尹丽晶

Word Count: 33 Thousand words Pages: 24 pages

Same series standard

GB/T 4937.34-2024 Semiconductor devices—Mechanical and climatic test methods—Part 34: Power cycling

Adopt standards

IEC 60749-35:2006

Related Standards

GB/T 14264-1993 Replaced

GB/T 14264-1993 Semiconductor materials—Terms and definitions

Publish Date: 1993-03-12

GB/T 14844-1993 Replaced

GB/T 14844-1993 Designations of semiconductor materials

Publish Date: 1993-12-24

GB/T 17573-1998 Active

GB/T 17573-1998 Semiconductor devices Discrete devices and integrated circuits Part 1:General

Publish Date: 1998-11-17

GB/T 12560-1999 Active

GB/T 12560-1999 Semiconductor devices Sectional specification for discrete devices

Publish Date: 1999-08-02

GB/T 11499-2001 Active

GB/T 11499-2001 Letter symbols for discrete semiconductor devices

Publish Date: 2001-11-05

GB/T 20521-2006 Active

GB/T 20521-2006 Semiconductor devices—Part 14-1:Semiconductor sensors—General and classification

Publish Date: 2006-08-23