GB/T 4937.35-2024 Active National standards

GB/T 4937.35-2024 Semiconductor devices—Mechanical and climatic test methods—Part 35:Acoustic microscopy for plastic encapsulated electronic components

GB/T 4937.35-2024 Semiconductor devices—Mechanical and climatic test methods—Part 35:Acoustic microscopy for plastic encapsulated electronic components

Publish Date: 2024-03-15 Implement Date: 2024-07-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us
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Basic Information

Standard Code: GB/T 4937.35-2024
Standard Type: National standards
Standard Status: Active
is_force_gb: no
CCS Name: Semiconductor discrete devices
ICS Name: Integrated Components of Semiconductor Devices
Publish Date: 2024-03-15
Implement Date: 2024-07-01
Pages: 24 pages

Scope

This document specifies the procedure for acoustic microscopy inspection of plastic-encapsulated electronic components. This document provides a method for using acoustic microscopy to inspect plastic packages for defects (delamination, cracks, molding voids, etc.), which is a reproducible, non-destructive testing method.

Development Information

Word Count: 33 Thousand words Pages: 24 pages

Same series standard

Adopt standards

IEC 60749-35:2006

Related Standards

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