DZ/T 0101.12-1994
Active
SJ 21454-2018
Active
Industry standards-Electronics
SJ 21454-2018 Integrated circuit ceramic package-Technical requirements for aluminum-silicon wire bonding process
SJ 21454-2018 Integrated circuit ceramic package-Technical requirements for aluminum-silicon wire bonding process
Price:
$ 30
Basic Information
Standard Code:
SJ 21454-2018
Standard Type:
Industry standards
Standard Status:
Active
is_force_gb:
no
CCS Name:
-
ICS Name:
-
Publish Date:
2018-01-18
Implement Date:
2018-05-01
Pages:
10 pages
Scope
This standard specifies the general requirements for the silicon-aluminum wire bonding process of military integrated circuits in ceramic packages (hereinafter referred to as the silicon-aluminum wire bonding process), and the detailed requirements for raw materials, equipment, process flow, key control points, and inspections. This standard applies to the silicon-aluminum wire wedge welding bonding process of the bonding area between military integrated circuit chips and ceramic housings.
Development Information
Referenced Standards
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