SJ 21448-2018 Active Industry standards-Electronics

SJ 21448-2018 Integrated circuit ceramic package-Inspection requirements for pre-bonding

Publish Date: 2018-01-18 Implement Date: 2018-05-01 For services related to genuine standard inquiry, procurement, translation, and other related services in China, please Contact Us

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Basic Information

Standard Code: SJ 21448-2018

Standard Type: Industry standards

Standard Status: Active

is_force_gb: no

CCS Name: -

ICS Name: -

Publish Date: 2018-01-18

Implement Date: 2018-05-01

Pages: 7 pages

Scope

This standard specifies the general and detailed requirements for the pre-bonding inspection of integrated circuit ceramic packages. This standard applies to the inspection of chips, shells, and bonding wires before the bonding of leads in integrated circuit ceramic packages.

Development Information

Pages: 7 pages

Referenced Standards

GB/T 25915.1-2010 Cleanrooms and associated controlled environments—Part 1:Classification of air cleanliness GJB 1420B-2011 GJB 3007 GJB 548B-2005 SJ 21449-2018 Interated circuit ceramic package-Inspection requirements for predie-attachment

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